Lithography

LocationCREOL Rm 180 DescriptionThe Apogee 200 Spin Coater is a high-performance, benchtop spin coating system designed for research and advanced process development in cleanroom environments. Featuring a full-colour 7-inch touchscreen interface, DataStream™ connectivity, and a chemical-resistant HDPE spin bowl, this tool delivers consistent and repeatable thin film coatings. It will be primarily used for coating…

LocationCREOL Rm 180 DescriptionThe MicroWriter ML3 is a compact, high-performance direct-write optical lithography tool tailored for R&D and clean-room environments. It eliminates the need for physical mask fabrication by projecting patterns directly via computer-controlled optics, enabling rapid prototyping of photoresist structures with resolutions down to sub-micron levels. The system is housed in a temperature-stabilised, light-excluding…

LocationEngineering 1, Rm 124 DescriptionComing Soon Configuration/SpecificationsComing Soon Substrate sizeComing Soon Standard Operating Procedure MakeSono-Tek ModelDev-Coat RateCECS Tier-1

LocationEngineering 1 Rm 163 DescriptionThe Laurell WS-650-23 is a precision spin coater designed for uniform thin film deposition on substrates up to 150 mm in diameter. Commonly used for photoresist, sol-gel, and other material coatings, it offers programmable spin profiles, variable acceleration, and a chemical-resistant chamber, making it ideal for research applications in photonics, MEMS,…

LocationCREOL Rm 180 DescriptionThe GCA 8500 is a projection lithography system used for high-resolution patterning of photoresist on semiconductor wafers. It offers precise alignment and exposure control for the fabrication of micro- and nano-scale devices in research and prototyping environments. Configuration/SpecificationsTropel 2235i 5:1 i-Line Reduction Lens0.85 μm resolution in 1.0 μm of resist for production0.75…

LocationMPF Rm 440 DescriptionThe OAI Model 200 Mask Aligner is a versatile photolithography tool designed for high-precision frontside alignment in microfabrication processes. Suitable for research and small-scale production, it offers reliable, repeatable exposure for MEMS, photonics, and microelectronic device fabrication. Configuration/Specification5x, 10x, and 2x objectivesNominal 1 µm resolution2 µm alignment accuracyProximity and contact mode Substrate…

LocationMPF Rm 440 DescriptionThe Laurell WS-650-23 is a precision spin coater designed for uniform thin film deposition on substrates up to 150 mm in diameter. Commonly used for photoresist, sol-gel, and other material coatings, it offers programmable spin profiles, variable acceleration, and a chemical-resistant chamber, making it ideal for research applications in photonics, MEMS, and…

LocationCREOL Rm 180 DescriptionThe Laurell WS-650-23 is a precision spin coater designed for uniform thin film deposition on substrates up to 150 mm in diameter. Commonly used for photoresist, sol-gel, and other material coatings, it offers programmable spin profiles, variable acceleration, and a chemical-resistant chamber, making it ideal for research applications in photonics, MEMS, and…

LocationCREOL Rm 180 DescriptionThe SUSS MJB4 is a precision mask aligner designed for photolithography processes on substrates up to 4 inches in diameter. It offers soft contact, hard contact, and proximity exposure modes, providing flexibility for a range of microfabrication applications including MEMS, photonics, and device prototyping. The system is equipped with a high-intensity mercury…

LocationCREOL Rm 180 DescriptionThe Raith EBPG 5200 Plus is a high-performance electron beam lithography system designed for advanced nanofabrication applications. Operating at acceleration voltages of 50 kV and 100 kV, it achieves ultra-high-resolution patterning with feature sizes below 5 nm and overlay accuracy better than 5 nm. Configuration/Specifications50, 100 kV125 MHz pattern generator200, 300, 400…