Lithography

LocationEngineering 1 Rm 124 DescriptionThe EVG 620 is a high-precision mask aligner designed for photolithography processes in micro- and nanofabrication. It supports both frontside and backside alignment, making it ideal for a wide range of applications including MEMS, optoelectronics, and photonics. The system is capable of handling various substrate sizes and provides excellent alignment accuracy…

LocationEngineering 1 Rm 163 DescriptionThe DWL 66+ laser writing system can be used for the patterning of photomasks, iterative testing of patterns as well as direct writing for small or temporary use cases. Global and feature alignment is available for direct write layers, using both top-side and bottom-side cameras. Additional features include  vector exposure and…