Characterization

LocationCREOL Rm 180 DescriptionThe Dimension 3100 AFM is a highly capable atomic force microscope used for nanoscale surface characterization. It provides high-resolution 3D topography imaging and advanced surface property measurements across a range of materials. The system supports multiple imaging modes—such as tapping and contact modes—and is suitable for analyzing surface morphology, roughness, and functional…

LocationCREOL Rm 180 DescriptionThe Nikon Eclipse L150 is a compact, ESD-safe industrial microscope optimized for semiconductor and materials science applications. It supports various reflected light contrast techniques—brightfield, darkfield, Nomarski DIC, and basic polarization—and features a trinocular head for camera integration. Ideal for wafer-level inspection, it combines high optical performance with ergonomic controls. Configuration/Specifications5MP Excelis digital camera…

LocationEngineering 1, Rm 124 DescriptionA high-precision rotating-compensator ellipsometer tailored for sensitive thin-film and optical property measurements in cleanroom environments. It features focused-beam optics for tight spot size and is ideal for mapping and characterizing semiconductor wafers and other substrates. Configuration/SpecificationsSpectral range: Deep‑UV to NIR, 190–1700 nmDetector: High-speed CCD spectrometerAngle of incidence: 45-75°Ψ accuracy: ±0.075°, Δ accuracy:…

LocationEngineering 1, Rm 124 DescriptionThis is a thin-film stress measurement instrument. It calculates film stress by measuring the change in radius of curvature of a substrate caused by the deposition of a thin film on the substrate. This requires measurement of the original substrate radius of curvature (first scan) followed by a second (single) scan…

LocationCREOL Rm 180 DescriptionThe Filmetrics F20 is a versatile, benchtop thin-film measurement system designed for rapid and precise characterization of film thickness and optical constants (refractive index n and extinction coefficient k). Utilizing spectroscopic reflectometry, it delivers sub-second measurements and supports a wide range of applications, including semiconductors, optics, biomedical devices, and advanced materials research.…

LocationEngineering 1, Rm 163 DescriptionThe Dektak 150 is a high-precision stylus profilometer used for surface topography and step height measurements in microfabrication and thin film processes. It enables non-destructive surface characterization with excellent repeatability, ideal for research applications in semiconductors, photonics, and MEMS. Configuration/SpecificationsMeasurement Type: Stylus surface profilometryScan Length Range: 55mm (2.16in.)Data Points Per Scan:…

LocationCREOL Rm 180 DescriptionThe Bruker Dektak XT is a high-resolution stylus profilometer used for precise surface topography measurements. It enables accurate step height, roughness, and thin film thickness characterization, making it essential for semiconductor, MEMS, and thin film research. Configuration/SpecificationsStylus Type: Type B stylus (typically 2 µm tip radius)Measurement Range: Up to 1 mm vertical…

LocationEngineering 1, Rm 163 DescriptionThe Hitachi S-4700 is a high-resolution field emission scanning electron microscope designed for detailed surface imaging and characterization at the nanoscale. It provides excellent imaging capabilities for materials research, semiconductor analysis, and device inspection. Configuration/SpecificationsElectron Source: Cold Field Emission Gun (FEG)Accelerating Voltage: 0.5 kV to 30 kVResolution:1.5 nm at 15 kV2.0…

LocationCECS Rm 163 DescriptionThe VK-X3000 3D Surface Profiler uses a triple scan approach, where laser confocal scanning, focus variation, and white light interferometry measurement methods are used, so that high-accuracy measurement and analysis can be performed on any target. It allows for measurement of the overall shape of the target while still maintaining high-resolution for…