Thermal Processing

LocationCREOL Rm 180 DescriptionThe UniTemp RTP-150 is a compact, high-performance rapid thermal processing and vacuum annealing system designed for research and development applications in semiconductor and materials science cleanrooms. It uses a quartz chamber and 24 infrared lamps to provide fast, uniform heating and controlled cooling, ideal for processes such as annealing, alloying, densification, and…

LocationCREOL Rm 180 DescriptionA robust and precise programmable convection oven, the DKN‑400 uses forced-air circulation to maintain stable temperatures between room temp + 10 °C and 260 °C, making it ideal for semiconductor and cleanroom thermal processes. It features PID control with 30-program memory, self-diagnostics (including auto-tune, calibration offset, and overheat protection), and visible/alarm alerts to ensure reliability. The…

LocationEngineering 1, Rm 163 DescriptionHigh temperature furnaces for wet/dry oxidation (water bubbler based) and P and N type diffusion from solid sources. Configuration/SpecificationsMaximum temperature of 1100 deg C. Substrate size4″ substrates MakeThermco-Expertech ModelMiniBrute RateCECS Tier-1

LocationCREOL Rm 180 DescriptionThe Despatch Protocol Plus is a high-precision, cleanroom-compatible oven designed for controlled thermal processing in semiconductor, photonics, and MEMS fabrication environments. It provides consistent, uniform heating for applications such as bake, cure, and annealing processes Configuration/SpecificationsProcess Type: High-uniformity convection ovenTemperature Range: Ambient to 260°C (500°F)Temperature Uniformity: ±1.5°C at 200°C Substrate size4″ substrates…

LocationEngineering 1, Rm 163 DescriptionThe Jetfirst RTP 150 is table-top, lamp-heated Rapid Thermal Process (RTP) tools used for annealing, and general thermal processing. Configuration/SpecificationsThese tools are designed for heating up to 800°C with rise times up to 15°C/sec but can only support short dwell times (<10-15mins) at maximum temperature. Substrate size4″ substrates MakeJipelec ModelJetFirst 150…

LocationEngineering 1, Rm 124 DescriptionThe Across International TF1400 is a versatile, high-temperature tube furnace designed for material research, annealing, and thermal processing applications in semiconductor, photonics, and MEMS fabrication. Its precise temperature control and robust build make it ideal for cleanroom and laboratory environments. Configuration/SpecificationsMax Temperature: 1400°CAr, 3% H2/Ar Substrate size4″ substrates Operations Manual MakeAcross…

LocationEngineering 1, Rm 124 DescriptionThe Lindberg Blue M is a versatile, high-temperature tube furnace designed for thermal processing applications. It provides stable, uniform heating in a controlled atmosphere for semiconductor and photonic device fabrication. Configuration/Specifications1100degC2% O2/Ar, O2, N2, bubbler Substrate size3″ substrates Operations Manual MakeLindberg/Blue M ModelSTF55666C-1 RateCECS Facility Use

LocationCREOL Rm 180A DescriptionThe MDL ModuLab 906 furnace is a manual tube furnace designed for semiconductor processing applications, particularly thermal oxidation of silicon wafers. Capable of operating in ambient, dry oxygen, or steam environments for oxide layer growth. Configuration/Specifications1200C Substrate size4″ wafers Standard Operating Procedure MakeMaterials Development Laboratory ModelModulab 906 RateCREOL Facility Use