Dry Etch

LocationCREOL Rm 180 DescriptionThe Plasma-Therm Apex SLR is an inductively coupled plasma (ICP) etcher designed for high-precision, anisotropic etching of a wide range of materials. It features a 2 MHz, 1 kW ICP source for high-density plasma generation and a 13.56 MHz, 300 W RF bias for independent substrate control, allowing excellent control over etch…

LocationCREOL Rm 180 DescriptionThe Plasma Etch PE-100 is a tabletop plasma asher designed for resist descum, surface cleaning, and gentle material removal applications. It provides uniform, low-power plasma processing ideal for preparing substrates prior to deposition, etching, or packaging processes. The system supports both oxygen and inert gas plasma treatments for organic contamination removal and…

LocationEngineering 1, Rm 124 DescriptionCustom made Configuration/SpecificationsAr, O2 Substrate size2″ substrates MakeCustom ModelCustom RateCECS Tier-2

LocationEngineering 1, Rm 124 DescriptionThe March Jupiter II is a versatile reactive ion etching (RIE) system designed for precision anisotropic and isotropic etching of a wide range of materials. Commonly used for applications in photonics, MEMS, and microfabrication, the system offers reliable performance for etching dielectric, polymer, and photoresist materials. Configuration/SpecificationsSF6, N2, O2 Substrate size4″…

LocationPhysical Sciences Building, Rm 440 DescriptionThe Samco RIE-1C is a compact, semi-automatic reactive ion etching (RIE) system used for precision etching of dielectric, semiconductor, and polymer materials. This system is widely used in microfabrication processes including photonics, MEMS, and thin film device applications. Configuration/SpecificationsEtch Type: Capacitively coupled parallel plate RIERF Power: 13.56 MHz, maximum 200…

LocationEngineering 1, Rm 163 DescriptionThis is a semi-automatic reactive ion etching (RIE) system designed for anisotropic and isotropic etching of dielectric, passivation, and semiconductor materials. It supports a broad range of materials, including silicon dioxide, silicon nitride, silicon oxy-nitride, silicon, polycrystalline silicon, polyimide, photoresist, and various polymer films. The system accommodates substrates up to 6…

LocationPhysical Sciences Building, Rm 440 DescriptionThe Trion Minilock II is a versatile inductively coupled plasma (ICP) etcher designed for high-density, anisotropic etching of a wide range of materials including dielectrics, semiconductors, and polymers. The system features independent control of ICP source and RF bias power, providing precise control over etch profiles, rates, and selectivity. Its…

LocationCREOL Rm 180F DescriptionThe Oxford PlasmaPro 100 Cobra is a high-performance Inductively Coupled Plasma Reactive Ion Etching (ICP-RIE) system designed for advanced microfabrication applications. It features a high-density plasma source that enables fast etch rates with excellent uniformity and precision, making it suitable for processing wafer sizes up to 100 mm. The system offers a…