June 3, 2025
LocationEngineering 1 Rm 124 DescriptionThis custom-built system from AJA International closely matches the specifications of the ATC-2200E series, featuring a cylindrical UHV-style chamber. It is equipped with multi-pocket linear UHV electron beam evaporation sources, enabling high-purity thin film deposition. The system also includes a turbo molecular pump (TMP) and load-lock capability, ensuring excellent vacuum integrity…
June 3, 2025
LocationEngineering 1, Rm 124 DescriptionThe AJA ATC 2200-V is a versatile physical vapor deposition (PVD) system designed for a wide range of thin film applications. It features a load-locked chamber, turbo molecular pumping, and multiple circular magnetron sputtering sources with in-situ source head tilting. This allows for precise and repeatable confocal, direct, and off-axis thin…
June 3, 2025
LocationEngineering 1, Rm 124 DescriptionThe Orion III PECVD system produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels. It features a load lock for improved sample handling and reduced chamber contamination, making it ideal for research in photonics, MEMS, and…
June 3, 2025
LocationCREOL Rm 180 DescriptionThe Temescal FC-2000 is an electron beam physical vapor deposition (EBPVD) system designed for high-purity thin film deposition in research and prototyping applications. It supports multi-material deposition with precise control over thickness and deposition rates, making it ideal for photonics, MEMS, and microelectronics device fabrication.The system operates in a high-vacuum environment and…
May 23, 2025
LocationCREOL Rm 180F DescriptionPlasmaTherm Advanced Vacuum PECVD with silane and ammonia source gases capable of depositing high quality SiOx and SiNx films. Configuration/Specifications350C maxNH3, SiH4, SF6, N2O, Ar, N2 Substrate size4″ wafers, pieces MakePlasmaTherm ModelVision 310 PECVD MKII RateCREOL Tier-3