Location
Physical Sciences Building Rm 440
Description
The Trion Orion II is a compact, high-performance Plasma-Enhanced Chemical Vapor Deposition (PECVD) system designed for depositing high-quality dielectric thin films. Its unique reactor design offers precise process control for applications in microelectronics, photonics, and MEMS fabrication. This system uses TEOS as a silicon source and operates without a load lock.
Configuration/Specifications
RF Power Supply: 600 W at 13.56 MHz
Temperature Range: Up to 400 °C
Pressure Range: Up to 10 Torr
Process Gases: TEOS, O2, CF4, He, N2, Ar
Substrate size
4″ substrates
Standard Operating Procedure
Make
Trion Tech
Model
Orion II
Rate
MPF Tier-3