Location
Physical Sciences Building, Rm 440
Description
The Trion Minilock II is a versatile inductively coupled plasma (ICP) etcher designed for high-density, anisotropic etching of a wide range of materials including dielectrics, semiconductors, and polymers. The system features independent control of ICP source and RF bias power, providing precise control over etch profiles, rates, and selectivity. Its load-locked configuration minimizes chamber contamination and improves process repeatability.
Configuration/Specifications
Etch Type: Inductively Coupled Plasma Reactive Ion Etcher (ICP-RIE)
ICP Source Power: Up to 600 W
RF Bias Power: Up to 300 W at 13.56 MHz
Available Process Gases: C₄F₈, CHF₃, SF₆, CF₄, O₂, Ar, He
Wafer Handling: 4-inch (100 mm) wafers, mechanically clamped
Backside Cooling: Helium backside cooling
Substrate size
4″ substrates
Standard Operating Procedure
Make
Trion Technology
Model
MiniLock II
Rate
MPF Tier-3