Location
CREOL Rm 180
Description
The Plasma-Therm Apex SLR is an inductively coupled plasma (ICP) etcher designed for high-precision, anisotropic etching of a wide range of materials. It features a 2 MHz, 1 kW ICP source for high-density plasma generation and a 13.56 MHz, 300 W RF bias for independent substrate control, allowing excellent control over etch rates and profiles.
The system is equipped with eight process gases: Cl₂, BCl₃, C₄F₈, CHF₃, SF₆, CF₄, O₂, and Ar, making it highly versatile for etching silicon, compound semiconductors, and dielectric materials. Substrates up to 4 inches in diameter are mechanically clamped with helium backside cooling for temperature management during processing.
Typical applications include:
Silicon and compound semiconductor etching
Dielectric and passivation layer etching
MEMS device fabrication
Photonic structures
Configuration/Specifications
Etch Type: Inductively Coupled Plasma Reactive Ion Etcher (ICP-RIE)
ICP Source Power: 2 MHz, up to 1 kW
RF Bias Power: 13.56 MHz, up to 300 W
Available Process Gases: Cl₂, BCl₃, C₄F₈, CHF₃, SF₆, CF₄, O₂, Ar
Wafer Handling: 4-inch (100 mm) wafers, mechanically clamped
Backside Cooling: Helium backside cooling
Substrate size
4″ substrates
Make
PlasmaTherm
Model
Takachi/Apex SLR ICP
Rate
CREOL Tier-3