Location
CREOL Rm 180
Description
The SUSS MJB4 is a precision mask aligner designed for photolithography processes on substrates up to 4 inches in diameter. It offers soft contact, hard contact, and proximity exposure modes, providing flexibility for a range of microfabrication applications including MEMS, photonics, and device prototyping. The system is equipped with a high-intensity mercury lamp, delivering UV exposure at multiple wavelengths (typically 365 nm, 405 nm, and 436 nm), suitable for most standard photoresists. The MJB4 features a manual alignment microscope for accurate frontside mask-to-wafer alignment, supporting fine-resolution patterning in research and development environments.
Configuration/Specifications
350 W mercury arc lamp
Exposure Modes:
• Soft Contact
• Hard Contact
• Vacuum Contact
• Proximity Exposure
• Flood Exposure (with or without mask)
Resolution:
• Down to 0.5 µm in vacuum contact mode
• Approximately 1 µm in hard contact mode
• Approximately 2 µm in soft contact mode
Exposure Uniformity: ≤ 3% across the exposure field
Alignment Methods:
• Top-Side Alignment (TSA)
• Infrared (IR) Backside Alignment (optional)
Alignment Accuracy:
• < 0.5 µm for top-side alignment
• < 5 µm for backside alignment (2 µm under special conditions)
Stage Movement Range:
• X/Y: ±5 mm
• Theta (rotation): ±5°
Microscope Objectives: Equipped with 5x and 10x magnification lenses
Substrate size
5 mm × 5 mm up to 100 mm (4 inches)
Standard Operating Procedure
Make
Suss
Model
MJB4
Rate
CREOL Tier-1