Location
CREOL Rm 180
Description
The PELCO® FlexScribe™ is a super-fast, simple method for downsizing wafers and samples by scribing on the topside. It uses a scribing wheel mounted to a sliding scribing mechanism that always makes a straight scribe. This system is used to scribe a wide variety of materials without restrictions on shape, including glass slides, coverslips, silicon, III-V, sapphire and other crystalline and brittle materials. It can address very small samples down to 5mm up to 200mm wafers.
Configuration/Specifications
54343 Diamond Scribing Wheel
Substrate size
Up to 200mm
Standard Operating Procedure
Make
Pelco
Model
Flexscribe 200
Rate
CREOL Facility Use