Location
CREOL Rm 180F
Description
The Oxford PlasmaPro 100 Cobra is a high-performance Inductively Coupled Plasma Reactive Ion Etching (ICP-RIE) system designed for advanced microfabrication applications. It features a high-density plasma source that enables fast etch rates with excellent uniformity and precision, making it suitable for processing wafer sizes up to 100 mm. The system offers a wide electrode temperature range from 0°C to +60°C, supported by helium backside cooling for optimal temperature control. Applications span across GaAs and InP laser optoelectronics, SiC and GaN power electronics, MEMS, sensors, microLEDs, and metalenses.
Configuration/Specifications
ICP Power: 3000 Watts 13.56 MHz
Bias Power: 600 Watts 13.56 MHz
Backside Cooling: Quartz mechanical clamp
Available gases: Cl2, BCl3, CH4, O2, H2, Ar, C4F8, SF6
Substrate size
4″ wafers, pieces
Operations Manual
Make
Oxford
Model
Plasma Pro 100 Cobra
Rate
CREOL Tier-3