Location
CREOL Rm 180
Description
The Plasma Etch PE-100 is a tabletop plasma asher designed for resist descum, surface cleaning, and gentle material removal applications. It provides uniform, low-power plasma processing ideal for preparing substrates prior to deposition, etching, or packaging processes. The system supports both oxygen and inert gas plasma treatments for organic contamination removal and surface activation.
Configuration/Specifications
Etch Method: Capacitively coupled plasma (CCP)
RF Power: 0–150 W at 13.56 MHz
Process Gases: O₂
Substrate size
Standard Operating Procedure
Make
Plasma Etch
Model
PE-100
Rate
CREOL Facility use