Location
Engineering 1, Rm 124
Description
The Unitemp 2Z-HVS-200 is a high-vacuum wafer sealer designed for hermetic packaging of MEMS, photonic, and microelectronic devices. It enables precise control of atmosphere, pressure, and temperature during the sealing process, making it ideal for research applications requiring reliable vacuum or controlled-atmosphere packaging.
Configuration/Specifications
2 heated regions, each with Ø 200 mm and 6 component adaptors
Chamber height 100 mm
Temperature range bottom heater: up to 450 °C, top heater: up to 200 °C
bottom heater optional up to 600 °C
Ramp up rate 20 K/min (in vacuum)
Ramp down rate 20 K/min (in vacuum)
Vacuum capable up to 10exp.-6 hPa, incl. pump, gate valve and vacuum measurement
Interface USB incl. software UniSoft
Controller HVS-2604 (20 programs storable, each with 100 steps)
Dimensions 550 x 500 x 1060 mm (WxHxD)
Weight 81 kg
Voltage 230/400 V AC, 3 Phase, +N
Frequency 50-60 Hz
Current max. 3x16A
Connected load 11 kW
Substrate size
42mm diameter
Standard Operating Procedure
Make
UniTemp
Model
2Z-HVS-200
Rate
CECS Tier-2