Location
Engineering 1 Rm 163
Description
The DWL 66+ laser writing system can be used for the patterning of photomasks, iterative testing of patterns as well as direct writing for small or temporary use cases. Global and feature alignment is available for direct write layers, using both top-side and bottom-side cameras. Additional features include vector exposure and advanced grayscale exposure. The laser wavelength is 405nm(h-line).
Configuration/Specifications
Lens & resolution:
• Write Mode I (4 mm lens): 0.6 µm
• Write Mode III (10 mm lens): 1 µm
• Write Mode IV (20 mm lens): 2 µm
Substrate size
5″ photomask, 4″ substrates
Make
Heidelberg
Model
DWL66+
Rate
CECS Tier-4