Location
Engineering 1 Rm 124
Description
The EVG 620 is a high-precision mask aligner designed for photolithography processes in micro- and nanofabrication. It supports both frontside and backside alignment, making it ideal for a wide range of applications including MEMS, optoelectronics, and photonics. The system is capable of handling various substrate sizes and provides excellent alignment accuracy for complex multi-layer devices
Configuration/Specifications
Alignment Modes: Frontside, backside, and wedge compensation alignment
Exposure Source: 350 W Hg arc lamp (broadband UV: i-line, g-line, and h-line)
Wavelengths: 365 nm (i-line), 405 nm (h-line), 436 nm (g-line)
Alignment Accuracy: ≤ 1 μm (frontside), ≤ 2 μm (backside)
Exposure Modes: Soft contact, hard contact, vacuum contact, proximity
Backside Alignment Capability: Yes, with split-field microscope and infrared options
User Interface: Touchscreen control with recipe management
Substrate size
4″x4″ , 5″x5″ masks
3″, 4″ substrates
Make
EVG
Model
620
Rate
CECS Tier-2